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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

Get Free Ebook Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

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Review

From the book reviews:“The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)

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From the Back Cover

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniqueExplores emerging technologies in lead-free soldering

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Product details

Paperback: 268 pages

Publisher: Springer; Softcover reprint of the original 1st ed. 2015 edition (October 1, 2016)

Language: English

ISBN-10: 1489978011

ISBN-13: 978-1489978011

Product Dimensions:

6.1 x 0.6 x 9.2 inches

Shipping Weight: 1.2 pounds (View shipping rates and policies)

Average Customer Review:

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Amazon Best Sellers Rank:

#240,657 in Books (See Top 100 in Books)

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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability PDF

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability PDF

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability PDF

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability PDF